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ED58408
ED58408
ED58408
ED58408
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ED58408
ED58408
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 8POS GOLD
Sockets for ICs, Transistors


3,053
3,053 In Stock
More quantities are on the way.
Product Attributes
Type PARAMETERS
Contact Finish Thickness - Mating
30.0µin (0.76µm)
Type
DIP, 0.3" (7.62mm) Row Spacing
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Base Product Number
299-93
Mfr
Mill-Max Manufacturing Corp.
Pitch - Mating
0.100" (2.54mm)
Contact Finish Thickness - Post
200.0µin (5.08µm)
Contact Resistance
-
Package
Bulk
Features
Closed Frame
Housing Material
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature
-55°C ~ 125°C
Current Rating (Amps)
3 A
Number of Positions or Pins (Grid)
8 (2 x 4)
Product Status
Active
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole, Right Angle, Horizontal
Contact Finish - Post
Tin-Lead
Termination Post Length
0.126" (3.20mm)
Contact Material - Post
Brass Alloy
Series
299
Contact Finish - Mating
Gold
Material Flammability Rating
-
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Payment Method
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