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ED58326
ED58326
ED58326
ED58326
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ED58326
ED58326
Mill-Max Manufacturing Corp.
CONN IC DIP SOCKET 32POS GOLD
Sockets for ICs, Transistors


3,044
3,044 In Stock
More quantities are on the way.
Product Attributes
Type PARAMETERS
Contact Resistance
-
Mounting Type
Through Hole
Operating Temperature
-55°C ~ 125°C
Package
Tube
Pitch - Post
0.100" (2.54mm)
Base Product Number
115-93
Contact Finish Thickness - Mating
30.0µin (0.76µm)
Contact Material - Mating
Beryllium Copper
Type
DIP, 0.6" (15.24mm) Row Spacing
Termination Post Length
0.108" (2.74mm)
Material Flammability Rating
-
Mfr
Mill-Max Manufacturing Corp.
Pitch - Mating
0.100" (2.54mm)
Features
Open Frame
Contact Material - Post
Brass Alloy
Current Rating (Amps)
3 A
Housing Material
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination
Solder
Contact Finish - Mating
Gold
Contact Finish - Post
Tin-Lead
Series
115
Product Status
Active
Number of Positions or Pins (Grid)
32 (2 x 16)
Contact Finish Thickness - Post
200.0µin (5.08µm)
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Payment Method
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Mill-Max Manufacturing Corp.

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