Molex's Coeur High Current Interconnect system delivers up to 200 A of current across three diameter sizes (3.4mm, 6mm and 8mm) and offers a variety of configurations, connecting PCBS, busbars and cables. When fitting two rigid PCBS or busbars, it is difficult to perfectly align pins and sockets. A degree of float is required in these cases to accommodate any offset that may exist. Coeur High Current Interconnect systems offer floats of up to 1 mm in all three sizes (industry leading). This flexibility helps with wiring and also prevents potential damage to socket contacts.

     Compact electronic packaging requires a low height and small protrusion above the PCB or busbar, or both. All three Coeur high-current interconnect systems have connection heights as low as 5.00 mm. So there will be no higher protrusions above or below the circuit board,

     Power efficiency is critical to managing the cost of large power intensive operations, such as data centers and similar applications. The Coeur high current interconnection system is designed with multiple contact beams in each socket. This is used to ensure solid electrical performance (low voltage drop).