Toshiba Electronics Components and Memory announced the launch of two optocouplers in thin SO6L packaging, the "TLP5705H" and the "TLP5702H", which can be used as insulating gate drive ics in small IGBTs/MosFeTs. Both devices will be available for bulk shipment starting today.

     The TLP5705H is Toshiba's first product offering ±5.0A peak output current rating in a thin package (SO6L) with a thickness of only 2.3mm (maximum). Small and medium-sized inverters and servo amplifiers that traditionally use buffer circuits for current amplification can now drive their IGBT/MOSFET directly through the optocoupler without any buffer. This will help reduce the number of parts and miniaturize the design.

     The TLP5702H has A peak output current rating of ±2.5A. SO6L package is compatible with Toshiba's traditional SDIP6 package pad [1], which is convenient to replace Toshiba's existing products [2]. The SO6L is thinner than the SDIP6, allowing for greater flexibility in board component layout and support for board backside mounting or new circuit designs with highly device limitations.

     Both photocouplers have maximum operating temperature ratings of 125 ° C (Ta = -40 ° C to 125 ° C), making it easier to design and maintain a temperature margin. Toshiba also offers the TLP5702H (LF4) and TLP5705H (LF4) in a SO6L (LF4) package with lead molding options.