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  4. Stmicroelectronics introduces NFC Type 2 label IC: Enhanced privacy and NDEF for a new generation of more cost-effective products
Stmicroelectronics introduces NFC Type 2 label IC: Enhanced privacy and NDEF for a new generation of more cost-effective products
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     ST25TN512 and ST25TN01K NFC Forum Type 2 label ics from stmicroelectronics bring higher cost performance for merchant consumer interaction, product information sharing, brand protection and other applications. The ST25TN512/01K NFC tag IC is also suitable for smart cities and access control management. It supports a variety of user protection and privacy mechanisms, including a 7-digit unique chip identifier, TruST25™ digital signature, NFC Forum T2T Block level (Block) permanent write protection, And configurable Kill mode for permanently closing tags.

     The ST25TN512 and ST25TN01K are NFC Forum Type 2 certified, adopt ISO 14443 contactless smart card standard, and support NFC mobile phones or dedicated short distance card readers. Embedded memory contains up to 208 bytes (1664 bits) of user-specific memory.

     Tags that support NFC Data Exchange Format (NDEF) messages can trigger native actions on a smartphone without a dedicated application, such as opening a web browser or initiating Bluetooth® Bluetooth pairing. The enhanced NDEF (ANDEF) format also supports reading dynamic information, such as custom messages and unique Tap code, without explicitly updating the EEPROM.

     The manufacturing process of ST25TN512/01K NFC label IC is a new technology developed by stmicroelectronics, which leads the industry and can bring better performance to the products. Inside the label there is an internal tuned capacitor of 50pF, this capacitance value is widely used in the market, allowing inlay card integrators to plug and play. The tag collects the power required for the operation from the electromagnetic field of the 13.56MHz RF transmitter, so the complete system design requires only one more antenna. Other advantages include a wide operating temperature range from -40°C to +85°C and long data retention time. These ics are supplied in the form of cut wafers or ball-mounted wafers, or in the form of integrated DFN5 packages.
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