The MAX98396 is an efficient, single-stage dg speaker amplifier with industry-leading silent power, I/V sensing, power failure prevention engine (BPE), and dynamic headroom tracking (DHT). The IC realizes ultrasonic application, higher passband (fs> 50kHz) and bypass path of ultrasonic signal passing through the amplifier by providing support for sampling rate up to 192kHz, so it will not be attenuated by audio processing.

     Precise output current and voltage monitoring (I/V sensing) enables host devices to run speaker protection algorithms. Spread spectrum modulation (SSM) and edge rate control minimize electromagnetic interference and eliminate the output filtering required in traditional class d devices. In order to achieve industry-leading static power, ClassDG amplifier uses two power rails VBAT (3V to 5.5V) and PVDD (3V to 20V) to power the loudspeaker amplifier. Dg like amplifier switches between two power supply rails according to input signal level and/or power supply clearance.

     When the power supply of the equipment falls below a set of programmable thresholds, the power failure prevention engine in the equipment reduces its contribution to the power consumption of the whole system by attenuating or limiting the output of the amplifier. In addition, due to changes in power supply voltage, sudden transients and reduced battery life, DHT automatic optimization can be used in the height space of dg like amplifiers to maintain consistent distortion and listening levels. The equipment provides PCM interface for audio data and standard I2C interface for controlling data communication. The PCM interface supports audio playback in I2S, left aligned and TDM audio data formats.

     The unique clock structure eliminates the need for an external master clock for PCM communication, which reduces pin counts and simplifies board layout. When the temperature exceeds the threshold value set by the user, opening the hot folding function will automatically reduce the output power. This allows music to be played continuously even when the ambient temperature is very high. In addition to powerful over-current protection, it can also provide traditional thermal protection. The device can adopt 0.4mm spacing, 35 bump wafer level package (WLP). The device operates in an extended temperature range of - 40 ° C to+85 ° C.