KEMET's KC-LINK surface-mount capacitors with KONNEKT technology are designed for high efficiency and high density power applications. KONNEKT technology uses an innovative transient liquid phase sintering (TLPS) material to create a surface-mount multi-chip solution for high-density packaging. By using KEMET's powerful proprietary C0G Fund Electrode (BME) dielectric system, these capacitors are well suited for power converters, inverters, buffers and resonators where high efficiency is a primary concern.

     KONNEKT technology enables low loss, low inductance packages to handle extremely high ripple currents with no change in capacitance with DC voltage and little change in capacitance with temperature. Operating temperature ranges up to +150°C, these capacitors can be mounted close to fast switching semiconductors in high power density applications that require minimal cooling. KC-LINK using KONNEKT technology also exhibits high mechanical robustness compared to other dielectric technologies, allowing capacitors to be installed without the use of metal frames.

     These capacitors can also be mounted in low loss directions to further increase power handling capacity. The low loss orientation reduces the effective series resistance (ESR) and the effective series inductance (ESL), improving the processing capacity of ripple current.