Intel has announced the industry\'s first implementation of backside power delivery technology on product-level test chips to meet the performance needs of the next era of computing. As Intel\'s industry-leading backside power solution, PowerVia will be available on Intel 20A process nodes in the first half of 2024.

Sensor innovations allow vital signs to be measured at home with clinical precision, samples can be tested at the point of care, and then sample versions do not need to be sent to a remote laboratory for processing, producing faster results to accelerate diagnosis rates. The latest multi-parameter wearable sensors can combine vital signs with other metrics, such as movement and sleep, and put medical data in the context of a patient\'s lifestyle habits.

Renesas Electronics, a global provider of semiconductor solutions, announced the launch of the first development suite to support the new Matter protocol, and announced that it will be included in all future Wi-Fi, Bluetooth Low Power (BLE), and IEEE 802.15.4 (Thread) solutions. As well as its recently acquired Dialog Semiconductor and Celeno Communications products, offering support for Matter.

Toshiba Electronic Components & Storage Corporation announced the launch of the Automotive brushless DC motor gate driver IC, the "TB9083FTG", which is suitable for applications such as electric steering assist systems (EPS), electric braking systems and drive-by-wire shift systems.

Recently, Samsung announced that it will introduce an upgraded 3 nm and 4 nm chip process, which is a significant advance that will have a significant impact on the semiconductor industry

Qualcomm Technologies and Mercedes-AMG Petro F1 team have announced a multi-year agreement based on the Snapdragon brand. This strategic partnership will leverage the powerful capabilities of the Snapdragon  platform to create a unique on-site and digital experience for car fans.

At present, driven by the intelligent revolution, new applications of AIoT, represented by smart home, smart security, smart city and smart connected vehicles, have broken out one after another, and the AIoT industry shows rapid development of multiple tracks. As the bottom support of intelligent terminal and networking, AIoT chip has stable and good growth characteristics.

Ames Osram, Inc., a leading global provider of optical solutions, announced that Aldo Kamper has been appointed Chief Executive Officer and Chairman of the Board of Directors effective April 1, 2023. Earlier on 30 January 2023, the Supervisory Board of Ames Osram made the appointment and announced this decision. In addition, effective April 1, Aldo Kamper has assumed the position of Chief Executive Officer of OSRAM Licht AG, a subsidiary of Ames Osram Group.

Qorvo has announced that its RF Fusion22™ chipset has won the 2023 GTI Mobile Technology Innovation Breakthrough Award. The award is in recognition of Qorvo\'s technological innovation in the field of 5G chipsets, which can provide compact, high-performance 5G capabilities to major smartphone manufacturers. This is the third GTI Award for Qorvo 5G products.

TE Connectivity, a global technology company in the field of connectivity and sensing, is presenting innovative solutions in the industrial, medical and energy sectors at the 2023 Shenzhen International Sensor and Application Technology Exhibition. During the exhibition, the theme will be shared on "2023 International Industrial Internet Ecological Conference" and "Energy Industry Sensor and Application Technology Summit Forum".