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Class I ceramic technology for High power density applications
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Whether for communications, providing secure and reliable storage for large amounts of data, or for electric and hybrid electric vehicle transportation, our society is increasingly dependent on electricity. Therefore, the guarantee of electricity supply is essential to enjoy modern life. One of the most pressing issues is energy efficiency -- in part because of the rising cost of electricity and our desire to conserve the natural resources used to generate it. Efficiency is one of the most important considerations when switching to new energy sources such as solar and wind power, or when considering the cooling requirements of electronic circuits.
 
Engineers around the world are constantly looking for ways to improve the efficiency of devices, including advanced circuit topologies such as resonant converters, smart power management, and the adoption of new materials. In the field of power semiconductors, wide-band gap (WBG) devices are beginning to gain popularity, allowing power conversion devices to operate at higher frequencies, temperatures and voltages. As switching speeds increase, the size of key components such as capacitors and magnetic devices can be reduced, providing greater power density at higher power conversion efficiency.
 
Most attention has been focused on switching semiconductor devices to improve efficiency and power density, since they are useful for static and dynamic losses in any power supply system. However, it is getting harder and more expensive to make small improvements, so engineers are looking for other ways to improve efficiency.Although many engineers consider capacitors to be supportive components of power supply design, there is a growing recognition of the need to improve their efficiency and thus their power density. In power supply design, capacitors have a positive impact on system efficiency in three ways, each with slightly different requirements for capacitors.
 
First, the buffer may require high dV/dT, high ripple current, high voltage, high temperature, and low inductance. Second, a DC link requires high ripple current, voltage, temperature, and frequency. Third, resonant converters require high ripple currents, a wide operating voltage range, and capacitance stability that varies with temperature and AC/DC voltage. Taking into account the combined requirements of the above applications, capacitors should have extremely low losses, high ripple current handling capacity, the ability to withstand high voltages and accept higher operating temperatures, while having stable capacitance and high mechanical stability. In order to achieve high density and high efficiency power supply using wide-band gap semiconductors, high temperature and mechanical stability of the capacitors in these packages must be made.
 
Class I and Class II multilayer ceramic capacitors (MLCC)
 
Among the many types of capacitors on the market, ceramic capacitors (especially multilayer MLCCS) can provide critical characteristics required for buffers, DC links, and resonance applications. MLCC is formed by alternating metal electrode layers with ceramic dielectric layers. Each layer represents a separate capacitor, and since they are arranged in parallel, increasing the number of layers provides more capacitance. The vast majority of MLCCS produced today are made with base metal electrodes (Bmes) - metal electrodes with nickel - and either CaZrO3 (Class I) or BaTiO3 (Class II) dielectrics.
 
                                                                                   
                                                                                                 Figure 1: Decomposition of base metal electrode MLCC
 
Stability
 
Dielectrics are classified according to their capacitance stability at temperature. Class I contains dielectrics (C0G, NPO, U2J) that are the most stable for temperature, but they have the lowest permittivity (K) and require larger volumes in order to achieve the same capacitance as more traditional types of MLCCS. Class II includes dielectric materials (X7R, X5R) with moderate temperature stability and K values. As a result, Class II provides higher capacitance per unit volume compared to Class I MLCCS. Although Class II MLCCS have higher overall capacitance, engineers must be aware of some key design considerations to avoid having a significant impact when using them for power applications.
 
Because Class II MLCCS use BaTiO3 dielectrics, the actual capacitance is affected by the operating temperature, the DC bias applied, and the time that has elapsed since the last heating (aging). The stability of a capacitor to temperature is called the temperature capacitance coefficient (TCC), and it can be determined by the Electronic Industry Alliance (EIA) dielectric classification (e.g. "X7R"). The EIA defines X7R as operating in a temperature range of -55 ° C to 125 ° C with a maximum capacitance limit of ±15%. The X5R has the same ±15% capacitance limit but operates in a temperature range of -55C to 85C. The stability of capacitance to voltage (VCC) is also an important consideration, but it is not formally defined by EIA. However, for Class II MLCCS with higher capacitance, the capacitance can be reduced by up to 80% at rated voltage, which can have a considerable impact on applications. This VCC feature may also vary from vendor to vendor. In addition to temperature and voltage, capacitance is also reduced by the amount of time that has elapsed since it was last heated. This is called aging and typically decreases by 2-5% every ten hours after the last heat above 130℃ (usually when welding parts during manufacturing).
 
However, Class I dielectrics are more stable than Class II dielectrics. Dielectric such as C0G has negligible capacitance drift of only 30ppm/℃ or 0.3% at 125℃, whereas U2J is 750ppm/℃ or 7.5% at 125℃, but is linear and predictable. Both C0G and U2J have negligible capacitance changes with respect to DC bias and little change with respect to time (aging). These properties make Class I dielectrics ideal for resonant applications, such as LLC resonant converters and wireless charging circuits, where it is important to keep capacitors within narrow tolerances.
 
Equivalent series resistance
 
In power applications, in addition to capacitance stability, the equivalent series resistance (ESR) is an important feature of capacitors due to i2R losses. Figure 2 compares the ESR of Class II X7R and Class I C0G/U2J MLCC at 100Hz to 100MHz. Because BaTiO3 is a ferroelectric material, it generates domain properties within the dielectric, as well as domain wall heating and ESR increase compared to Class I dielectric. As a result, Class II MLCCS typically have an ESR one or two orders of magnitude higher than Class I MLCCS.
 
                                                                        
                                                                                      Figure 2: Comparison of ESR between Class II X7R and Class I C0G/U2J
 
Because of the larger AC current in power applications, MLCC ESRs are larger and can directly cause overheating. FIG. 3 shows the relationship between temperature and AC current of X7R, C0G and U2J MLCC. Data show that the self-temperature rise of C0G and U2J at 10A is about 15℃, while the temperature rise of X7R reaches 40℃ only at 5A.
                                                                  
                                                                                    
                                                                               Figure 3: Comparison of ripple currents between Class II X7R and Class I C0G/U2J
 
                                                                           
                                                                                Figure 4: Comparison of key features between Class II X7R and Class I C0G/U2J
 
Class I technical progress
 
Because of their high temperature stability, low loss, and high ripple current capabilities, MLCCS using Class I BME dielectrics are clearly ideal for high power density applications. KEMET has created a portfolio of products using patented Class I BME CaZrO3 dielectric technology, which further enhances power processing capabilities for buffer, DC link and resonance applications.
 
Products in this category include the C0G high voltage commercial and automotive grade series, which provide a wide voltage range of 500 to 10,000VDC with EIA housing sizes of 0603 to 4540. BME C0G CaZrO3 dielectric enables extremely low ESR, low ESL, high ripple current processing capability and high dV/dT.
 
The electronic component expert also introduced the surface mount KC-LINK 3640 220nF 500V ceramic capacitor, which is made of CaZrO3 dielectric material, resulting in a very low loss solution - ESR values are below 4mΩ from 40kHz to 1MHz, and as low as 2mΩ at around 50kHz. Therefore, its typical ripple current from 50kHz to 300kHz at 105℃ ambient temperature and 0VDC bias is about 20A, as shown in the figure below.
                                           
                                                                                  
                                                                                                     Figure 5:KC-LINK impedance, ESR, and ripple current
 
KONNEKT technology
 
Even when applications use high-performance Class I dielectric capacitor designs, they usually need to provide higher levels of capacitance, which can be achieved by increasing the board area. Traditionally, however, increasing the area of the board reduces the power density of the solution. Therefore, Kimei Electronics has developed KONNEKT technology, a leadless multilayer chip solution for high efficiency, high density power applications that can solve this problem. KONNEKT uses a transient liquid phase sintering (TLPS) process to combine Class I MLCCS, which can be installed using standard reflow soldering methods. An example of how this technology can provide high power processing capability is provided in the appendix.
 
Summarize
 
In order to reduce operating costs for applications such as automobiles and data centers that use a lot of electricity, energy efficiency is an important consideration in the modern world. While much of the development work to date has focused on circuit topology and semiconductor performance, passive components such as capacitors can also have a significant impact on power supply efficiency.
 
In power applications, Class I materials, including C0G and U2J, offer excellent stability, and designers can achieve precise tolerances because MLCC properties are predictable. New technologies such as KONNEKT technology can provide large capacity capacitors with a small footprint, thus significantly increasing power density.
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