Automotive application solutions to meet electronic requirements

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Automotive application solutions to meet electronic requirements

February 15 , 2023 0

Automotive electronics market rapid development of huge business opportunities

In addition to the trend toward electrification, even gas-powered vehicles are adding more and more safety, lighting, entertainment, and electronic systems, Common automotive electronics applications include ADAS radar sensor modules, airbag controllers, anti-deadlock braking systems, automatic HVAC BLDC motors, cooling fans, electronic fuel injection, electric power steering, adaptive LED headlights, On-Board chargers, OBC), car network (CAN/LIN/FlexRay), multimedia/infotainment systems, touch screens, cameras, LED lighting, DC/DC converters, etc., the required electronic products and market opportunities are quite large.

In addition, in today's world, cars must be more energy-efficient, and governments around the world have mandated reducing carbon dioxide emissions from cars in order to deal with climate change and protect resources. So the focus is on the powertrain -- whether combustion, hybrid or all-electric. Innovations in powertrain, chassis, safety, lighting and body electronics also help improve overall vehicle efficiency to reduce fuel consumption, carbon dioxide emissions and costs. Today's automotive industry is undergoing major changes, and automakers and auto parts manufacturers must improve the efficiency and effectiveness of their products in order to respond to changing market demands.

Nexperia manufactures a wide range of products, including bipolar transistors, diodes, electrostatic discharge protection (ESD), transient voltage suppression diodes (TVS), metal oxide semiconductor field-effect transistors (MOSFets) and logic devices for automotive applications. Nexperia consistently delivers products with great features and performance, in the right package, to help customers win by "increasing efficiency" in a competitive market.

Nexperia provides the automotive industry with a wide range of dedicated discrete components, MOSFETs and logic devices that are fully compliant with the AEC-Q100/Q101 standards. With traditional powertrains, chassis and body electronics, Nexperia's innovative solutions support new system designs that are compatible with future designs. From wireless vehicle safety systems to electric vehicle chargers, it is widely used. Based on dedicated manufacturing and supply chain, it produces energy-saving, efficient and simple design products, and can meet long-term bulk supply needs. The following will introduce several key Nexperia products for your reference.

ESD protection devices that meet automotive Ethernet specifications

To take the next step in vehicle connectivity and electrification, high-speed and high-bandwidth automotive Ethernet is needed, and numerous industry leaders are working together within the OPEN Alliance SIG to encourage the adoption of Ethernet in vehicles, The key goal is to implement the deployment of existing IEEE 100BASE-T1/1000BASE-T1 physical layer specifications and complement specifications for compliance and interoperability, but with more advanced electrical designs, discrete ESD protection becomes increasingly important.

Nexperia offers a portfolio of automotive Ethernet ESD protection devices that comply with the AEC-Q101 standard and the IEEE OPEN Alliance 100BASE-T1 and 1000BASE-T1 standards. Designed to protect two bus lines from damage caused by ESD and other transients.

Nexperia's PESD2ETH1GXT-Q, PESD1ETH1GLS-Q and PESD1ETH1GXLS-Q, for example, are silicon-based devices that offer a number of advantages over alternative ESD protection solutions such as varistors, providing greater reliability. Improved 1 pF (maximum) diode capacitance ensures better signal integrity.

Since these ESD protection devices are fully compliant with the IEEE OPEN Alliance's 100BASE-T1 and 1000BASE-T1 test specifications, this means that customers do not need to perform their own certification. Under test conditions, they outperform the AEC-Q101 certification standard by a factor of 2, so customers can be assured of meeting the highest vehicle quality requirements and providing the highest degree of reliability.

Compared to competing products, these three ESD protection devices combine silicon technology and springback features, reduce clamping voltage and residual current, and offer maximum design flexibility in minimal leaded (SOT23) and lead-free (DFN1006BD-2/SOD882BD) packages with wettable sides, Automatic optical inspection (AOI) can be realized to improve the assembly yield.

Gallium nitride FET has high power conversion efficiency

The electrification of vehicles is increasing the demand for high power and the need to improve power conversion efficiency. Reducing power loss is one of the major challenges facing the industry, and gallium nitride (GaN) is expected to become a mainstream technology. Gallium nitride technology presents a performance advantage over silicon (Si) and silicon carbide (SiC) solutions. Specifically, GaN field-effect transistors (FETs) can provide the best efficiency at a lower system cost, while making the system lighter, smaller, and cooler. GaN power transistors with better performance can be applied to higher power, which can meet the requirements of electric vehicle regulations.

Nexperia's GaN FeTs, which use next-generation high-pressure GaN HEMT H2 technology, as well as TO-247 and Nexperia's proprietary CCPAK surface-mount package, deliver superior switching quality factor (FOM) and on-state performance, improved stability and simplified application design. This is thanks to their cascading configuration, which eliminates the need for complex drives and controls.

The new GaN technology uses an epitaxial through-hole that reduces defects and reduces chip size by approximately 24%. In the initial version of conventional TO-247, the RDS(on), with high threshold voltage and low diode forward voltage, were also reduced TO only 41 mΩ (maximum, 35 mΩ typical value, at 25℃). For the surface mount version of the CCPAK, this reduction is further increased to 39 mΩ (maximum, typical value 33 mΩ, at 25℃). Because these components are configured as cascaded devices, they are also easily driven using standard Si MOSFET drivers, and both versions meet the requirements of the AEC-Q101 for automotive applications.

Nexperia continued TO invest in developing and expanding its product line using the next-generation GaN process, initially releasing the traditional TO-247 version and bare chip format for power module manufacturers and then introducing a high-performance surface mount CCPAK package. Nexperia's CCPAK surface-mount package uses Nexperia's proven and innovative copper clip package technology to replace internal bonding wires, reducing parasitic losses, optimizing electrical and thermal performance, and improving reliability. CCPAK GaN FeTs can be used in either top or bottom cooling configurations, making them versatile and helping to further improve heat dissipation.

Nexperia's GaN FeTs, including the 650 V GAN041-650WSB in TO-247 and the GAN039-650NBB in CCPAK, are efficient, cost-effective solutions for high power conversion between 650 V and approximately 30-40 mΩ RDS(on). Applications include on-board chargers, DC/DC converters in electric vehicles, and traction inverters

Schottky rectifier diode with new packaging technology

Schottky diode is a diode with low on-off voltage drop and allows high-speed switching. It is an electronic device generated by the use of Schottky energy barrier characteristics. When the current flows through a common diode, it will produce a voltage drop of about 0.7-1.7V, but the voltage drop of Schottky diode is only 0.15-0.45V, so it can improve the efficiency of the system. And produce the effect of rectification.

To enhance the performance of Schottky rectifiers, Nexperia introduced grooved Schottky rectifiers in copper Clip Bond FlatPower (CFP) packaging to meet the challenging requirements of efficient and space-saving designs. Schottky rectifiers in a CFP package combine low reverse current, low forward voltage, and minimum Qrr to achieve optimal efficiency at high ambient temperatures. Nexperia offers a number of CFP package options with high power capabilities. Nexperia is a true alternative to SMA packaging with better thermal performance and a smaller footprint, making it ideal for automotive applications.

In modern vehicle architectures, the number of electronic control units (ECUs) is gradually decreasing, leaving only high-performance, feature-rich ECUs responsible for front axle, rear axle, and body control. As a result, the diode device density of such units has increased substantially, and to achieve these higher density designs, manufacturers are increasingly relying on modern multilayer PCBS. The vertical cooling of these multilayer PCBS allows designers to save up to 75% of board space with CFP2-HP, while maintaining the same level of electrical performance, compared to diode devices encapsulated using SMA. This durable package design extends diode device run time and improves board level reliability, while the new lead shape improves automatic optical detection (AOI) performance.

Nexperia is offering A wide range of rectifier diodes for power applications. Available in standard and AECQ-101 versions in A new CFP2-HP package, Nexperia includes 45 V, 60 V and 100 V grooved Schottky rectifier diodes (with 1 A and 2 A options). For example, PMEG100T20ELXD-Q is A 100V, 2 A grooved Schottky rectifier diode. Nexperia also added A 200 V, 1 A PNE20010EXD-Q rectifier diode to its portfolio for applications requiring ultra-fast recovery.

Conclusion

The automotive electronic application market is showing a booming trend, the use of stable quality, high efficiency, in line with industry standards of electronic devices, will be an important key to the development of automotive electronic related products. Nexperia has a diverse and complete product line of automotive electronic ESD protection devices, power conversion devices and rectiters, which can meet the diversified development needs of customers and is worth further understanding and adoption.